하드웨어 인증 모듈 및 FIDO2 레벨 3+ 하드웨어 신뢰점

기업 신원 확인, 피싱 방지 자격 증명 생성 및 호스트 OS로부터 완전 격리된 마이크로초 단위 생체 인식 템플릿 매칭을 위한 전용 실리콘 엔클레이브를 배포합니다.

AuthHSM Hardware Authentication Architecture

Cryptographic Enclave: Authentication Cryptographic Enclave — FIPS 140-3 L3 / FIDO2 L3+ Core

Hardware Security Nodes & Co-Processors

  • FIDO2 CTAP2 Hardware Parser
  • Biometric Match-on-Chip Engine
  • PIV / CAC RSA/ECC Co-Processor
  • Physical User Presence Detector
  • Hardware Attestation Key (AIK)

Architectural Layers & Silicon Defenses

  • Layer 1: Physical Token & Tamper-Protected Silicon (Active Mesh / Physical Anti-Probing): Physically protecting private signing keys and master salt seeds against microprobing and laser fault injection.
  • Layer 2: Match-on-Chip Biometric Subsystem (Isolated RISC-V Neural Core / AES-256): Executing fingerprint and facial vector matching entirely within secure isolated SRAM with zero host memory exposure.
  • Layer 3: Cryptographic Protocol Translation Engine (WebAuthn CTAP 2.1 / FIDO U2F / PIV): Translating zero-trust browser WebAuthn challenges into hardware-signed assertions with cryptographic user presence binding.
  • Layer 4: Enterprise Identity Provider Gateway (PKCS#11 v3.0 / OpenID Connect / SAML 2.0): Interfacing hardware security modules with enterprise IAM, directory federations, and PAM bastion clusters.

Cryptographic Telemetry & Compliance: AAL3 (NIST SP 800-63B Level) | < 14 ms (Assertion Signing Latency) | 100% (Phishing-Resistant Enforce) | FIDO2 L3+ (Authenticator Certification)

하드웨어 강제 신원경계 및 피싱저항 엔클레이브

Software authentication is inherently susceptible to credential harvesting, memory interception, and session hijacking. AuthHSM establishes hardware-isolated cryptographic boundaries where asymmetric authentication keys never leave tamper-responsive physical silicon, enforcing mathematical user presence verification and hardware attestation.

Core Engineering Areas

Technical Publications

Related Cluster Architecture Specifications